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Position: Research Associate - Advanced Materials and Manufacturing in HI
Institution: Loughborough University
Location: Loughborough, Leicestershire, United Kingdom
Duties: To carry out literature survey on advanced materials and manufacturing processes for heterogeneous integration of hybrid/power electronics, in particular, thermal management and reliability of packaging techniques for Wide Band Gap (WBG) devices. To conduct scientific and technological research into developing advanced materials and processes viable for WBG power electronics modules. To design packaging structures and develop reliable and low-cost packaging integration methods with the developed materials. To establish suitable models to understand the performance and interfacial evolution of 2.5D or 3D packaging structures under multi-parametric coupled loadings (including thermo-, electro-, magnetic- and stress)
Requirements: Significant postgraduate research experience in advanced materials and manufacturing processes. Significant skills and previous experience of numerical modelling using advanced software packages, e.g. Ansys, Comsol, Icepak etc. Experience and strong track records in publishing conference and journal papers. Hold a PhD (or approaching completion of a PhD) in materials science, engineering, physics, chemistry or other relevant subject
Text: skip to job profile skip to job details University home About Study with us News and events Research Business Contact us Staff Recruitment Search for job Existing user login Forgotten password My applications My profile Job profile The job requirements are detailed below. Where applicable the skills, qualifications and memberships required for this job have also been included. Loughborough University is committed to achieving equality and valuing diversity in all aspects of employment and welcomes applications from all sections of the community. Job details Job title Research Associate - Advanced Materials and Manufacturing in HI Job reference REQ180354 Date posted 26/04/2018 Application closing date 03/06/2018 Location Loughborough Package Specialist and Supporting Academic Research Grade 6 from £29,799 - £38,833 Job description Wolfson School of Mechanical, Electrical and Manufacturing Engineering. Full Time, Fixed Term for 24 Months ( or less if start date after 31 October 2018) Heterogeneous integration of electronic devices provides a holistic System in Package (SiP) approach to electronics assembly with compact and unified functionality, enhanced reliability and reduced cost. This post offers an exciting opportunity in advanced materials and processes for heterogeneous integration of hybrid/power electronics. This project will focus on the development of novel embedding and 3D multi-material architecture, through subtractive lithography, 3D additive manufacturing, patterned deposition (e.g. electrolytic and electroless plating), precision micro-machining, with emphasis on the thermal and electrical reliability of the entire integrated system. Application Closing Date: 3 June 2018 Please follow this link for further details Send to a friend Apply online Vacancies RSS Feed © 2017 Loughborough University. All rights reserved.
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